| PART |
Description |
Maker |
| VMUSIC2 |
BINDING USB TECHNOLOGIES Vinculum VNC1L Module
|
Future Technology Devices International Ltd.
|
| TLWR8900 |
Utilizing one of the world brightest AllnGaP technologies LED
|
Vishay Siliconix
|
| 02009-LTB-001-A |
Mindspeed Technologies Physical Medium Dependent Product
|
M/A-COM Technology Solutions, Inc.
|
| 1837433 |
Maximum flexibility when it comes to device design ?one header for connectors with different connection technologies
|
PHOENIX CONTACT
|
| 1837310 |
Maximum flexibility when it comes to device design ?one header for connectors with different connection technologies
|
PHOENIX CONTACT
|
| CM7001 |
Voice and Audio Processor SOC Powered By Xear Sound Technologies
|
C-Media Electronics
|
| JESD22-A113-D |
Avago Technologies?ALM-2812 is a dual band low noise amplifier
|
AVAGO TECHNOLOGIES LIMI...
|
| BGA622L7 |
Infineon Technologies Introduces Fully Integrated SiGe LNA for GPS, WLAN, UMTS and further Mobile Applications
|
Infineon
|
| DMEG250-3 |
250 W, 50 V all devices utilize the most advanced design and process technologies, there features provide the most consistent and reliable chip
|
Acrian
|
| B4010 B4016 B4012 B4014 B4017 |
VDSL Filter and Hybrid Transformer Modules matched to Infineon Technologies VDSL chipset - (8/01) VDSL的过滤器和混合变压器模块匹配英飞凌VDSL芯片 / 01
|
Assmann Electronics, Inc.
|
| MSP1BR5000FS14E3 MSP1C10000FHT25E3 B10000FS14E3 B1 |
MSP Precision Surface Mount Resistors Wirewound or Metal Film Technologies
Wire Wound Resistor, RES,SMT,METAL FILM,1K OHMS,300WV,1% /-TOL,-25,25PPM TC,2715 CASE
Wire Wound Resistor, RESISTOR, WIRE WOUND, 1 W, 1 %, 25 ppm, 1000 ohm, SURFACE MOUNT, CHIP, ROHS COMPLIANT
|
Vishay Sfernice
|
